MPhil/PhD Scholarship Mathematical Modelling for Robust Design of Electronic Components

Ref: VCS-CMS-05-13


Robust design of electronic components is a critical requirement for high reliability applications such as satellites, aircraft, medical devices, and renewable energy systems.  This PhD provides a unique opportunity for the candidate to learn the skills of reliability engineering and develop mathematical and statistical models to predict the reliability and robustness of electronic components when subjected to harsh environmental conditions. These models will be embedded into software and validated against test data gathered by our industrial and academic partners. Support will be provided for the candidate to present their work at conferences both in the UK and internationally to disseminate their work.

Candidates should ideally have an engineering background (mechanical, electrical, materials, etc) and be familiar with solving differential equations using numerical methods and analyse data using statistical techniques. Experience with software languages such as C, C++ or Fortran is also required.     

The successful candidate will receive a £13726 bursary (years 2 and 3 linked to RCUK Doctoral Stipend rate) plus a contribution towards tuition fees of up to the equivalent of the university’s Home/EU rate for the duration of their scholarship, subject to performance.

Applicants must hold a First Class or Upper Second Class Honours Bachelor’s or Master’s degree (UK or UK equivalent) in a relevant discipline.

Applications are sought by the indicated closing date for starting in September 2013.

For further information please contact the supervisor: Professor Chris Bailey, 0208 331 8660 (email: [email protected])

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For additional information about the studentship and links to the application form please go to: 

The application form should be completed and returned to: [email protected]  and include: a comprehensive CV and a one page covering letter explaining your interest in the project and how it relates to past experience and present motivations. Attachments should be in PDF or Word format.

The closing date for applications is 12.00 UTC on Tuesday 11 June 2013

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